Events › Manufacturing & Industrial
Manufacturing & Industrial
The Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026 in Suwon, Korea, focuses on advanced packaging technologies, testing equipment, materials, parts, and chiplet/EDA solutions.
Attendees: Professionals from IDM, OSAT, AI&ICT, computing, automotive, and electronics manufacturers.
Exhibitor mix: Packaging & Test Equipment, Materials & Parts, EDA Software, Glass Packaging.
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Venue
Suwon Convention CenterMultipurpose · 10,000 m² · 1 halls · ~3,000 people
A major convention and exhibition facility located in Gwanggyo New Town, Suwon, South Korea. It features a convention hall, exhibition hall, and various meeting rooms designed for international conferences, exhibitions, and corporate events.
📍 103-24, Gwanggyojungang-ro, Yeongtong-gu, 16508 Suwon-si, KR
Operated by Suwon City (via management foundation)
Exhibitor list
43 companies are exhibiting at Advanced Semiconductor Packaging & Chiplet Show. A sample of 12 is shown below — unlock the full list to see all 43.
31 more exhibitors at Advanced Semiconductor Packaging & Chiplet Show.
Unlock the complete exhibitor list — every company, with optional ICP filtering and verified buying-committee contacts per matched account.
Why people attend
To explore the latest semiconductor packaging, chiplet technologies, and test solutions from major industry leaders in Korea and internationally.
Exhibitor categories
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Frequently asked questions